Intel Corporation announced Friday that it is investing $20 billion to build two new “leading-edge” chip factories in Ohio. “The investment will help boost production to meet the surging demand for advanced semiconductors, powering a new generation of innovative products from Intel and serving the needs of foundry customers as part of the company’s IDM 2.0 strategy,” the company said in a statement. IDM 2.0 is a new integrated device manufacturing model, which Intel CEO Pat Gelsinger announced on March 23, 2021. The move is part of Gelsinger’s strategy to restore Intel’s dominance in chip making and reduce America’s reliance on Asian manufacturing hubs, which have a tight hold on the market. The initial phase of the project, which spans around 1,000 acres in Licking County, will bring 3,000 Intel jobs and 7,000 construction jobs, Intel said. The company also committed an extra $100 million for talent training and research …